Company Profile

Pengcheng Micro Nano Technology (Shenyang) Co., LTD.

Pengcheng Micro Nano Technology (Shenyang) Co., LTD. (referred to as: Pengcheng Micro Nano), the company relies on Harbin Institute of Technology (Shenzhen), with advanced semiconductor research and development equipment platform and testing equipment platform, can carry out scientific research at a high starting point. Headquartered in Shenzhen, the company has the capability of R&D, production and commissioning of semiconductor equipment as well as pilot test, production and sales of semiconductor materials and devices.

The core business of the company is the R&D and manufacturing of semiconductor substrate materials, the R&D and manufacturing of semiconductor epitaxial sheets, and the R&D and manufacturing of semiconductor process equipment. Including semiconductor equipment (industrial mother-machine) research and development, manufacturing and sales; Mainly PVD, CVD and MBE series equipment; Hot wire CVD diamond process research and development, diamond process equipment design, manufacturing and sales; The focus is on the research and development of micron crystal, nanocrystalline crystal wafer and industrial mother-machine manufacturing; In the mode of production, university and research, focusing on the second, third and fourth generation semiconductors, we carry out the research and development and pilot test of semiconductor material preparation and industrial mother-machine, research and design independently controllable complete sets of process equipment and key components, research and design independently controllable semiconductor substrate materials and epitaxial sheets.

The knowledge structure of the company's talent team is complete, there is a senior equipment designer team from the industry, they have more than 20 years of semiconductor material research, epitaxial technology research and semiconductor film preparation complete equipment design, production and manufacturing experience.

Pengcheng Micro Nano has advanced semiconductor substrate materials, semiconductor research and development equipment platform and testing equipment platform, can carry out scientific research work at a high starting point. The company is headquartered in Shenzhen, with compound semiconductor substrate materials and epitaxial sheet research and manufacturing, such as gallium nitride, silicon carbide, gallium oxide, etc.

Laboratory and r & d center

R&D Center

XRay diffraction（XRD）

Atomic force microscope（AFM）

Reliability prediction and evaluation laboratory

Semiconductor material r & d laboratory

Scanning electron microscope-SEM

Some semiconductor equipment, compound semiconductor substrate materials and epitaxial wafers that the company has put on the market

|Compound Semiconductor Series

Gallium Nitride, Silicon Carbide, Gallium Oxide, Gallium Arsenide, Diamond, etc.

|Physical gas deposition（PVD）Series

Magnetron sputtering coater, electron beam coater, thermal evaporation coater, laser deposition equipment PLD, ion beam sputter coater, magnetron and ion beam composite coater

|Chemical gas deposition（CVD）Series

MOCVD, PECVD, LPCVD, microwave plasma CVD, Hot silkCVD, ALD equipment

|Ultra-high vacuum Series

Molecular Beam Epitaxy (MBE), Laser Molecular Beam Epitaxy (LMBE)

|A set of equipment

Cluster solar thin film battery pilot line, OLED pilot equipment (G1, G2.5)

|Other

Diamond Film Preparation Equipment, Hard Coating Equipment, Magnetic Thin Film Equipment, Electrode Preparation Equipment, Alloy Annealing Furnace

|Special power supply for vacuum coating machine/control system and software for vacuum coating machine

DC sputtering power supply, RF radio frequency sputtering power supply, high-precision thermal evaporation power supply, high-energy DC pulse power supply (medium frequency adjustable pulse width), control system and software

Team performance distribution

Fully self-designed and manufactured molecular beam epitaxy (MBE) equipment, including self-designed and manufactured MBE ultra-high vacuum epitaxy growth chamber, process control system and software, high temperature beam source furnace, high temperature sample stage, Rheed in-situ real-time online monitor (reflection Key components such as high-energy electron diffractometer), linear electron gun, film thickness meter (which can measure the number of molecular layers in epitaxial growth), and radio frequency source. The degree of vacuum reaches 2×10-8Pa.

The equipment was put into use in the State Key Laboratory of Optical Instruments of XX University in 2005 and is still in normal use today.

Design and manufacture a combined system of magnetron sputtering and plasma enhanced chemical vapor deposition (PECVD) technology, which is applied to the pilot line of cluster solar thin film cells. Use unit XX Institute of Electric Engineering.

Design and manufacture of diamond thin film preparation equipment, applied to research and pilot production equipment of diamond thin film materials. The current use unit is the Institute of Metal Research, XX Institute.

A fully automatic magnetron sputtering equipment is designed and manufactured, which can add horizontal and vertical magnetic fields, and a self-designed vacuum manipulator transfers the substrate. It is applied to the research and pilot test of high-density magnetic recording materials and devices. Now use the unit XX photoelectric laboratory.

Design and manufacture of OLED organic semiconductor light-emitting materials and devices research and pilot equipment. The current use unit is the Advanced Materials Laboratory of XX University.

MOCVD and alloy annealing furnaces are designed and manufactured for the epitaxial growth of GaN and ZnO, and the research and pilot test of LED inorganic semiconductor light-emitting materials and devices are realized. The current use unit is the National Silicon-based LED Engineering Technology Research Center of XX University.

Design and manufacture of OLED organic semiconductor light-emitting materials and devices research and pilot equipment. Typical users: Advanced Materials Laboratory of XX University, Jilin Allied Optoelectronic Materials Co., Ltd.

Design and manufacture of magnetron sputtering research equipment. The current use unit is the Semiconductor Institute of XX University.

Manufactured electron beam evaporator research equipment. The current use unit is XX University of Technology.

The team's technical accumulation in the third-generation semiconductor equipment and process

2023

PVD epitaxial gallium nitride equipment and technology research.

2022

Preparation of large size diamond wafer (≥ φ 6 inches).

2021

MBE production design.

2019

Design and manufacture of large-scale hot filament CVD diamond film production equipment.

2017

-Optimized Rheed design, started production MBE design.

-Started to develop the process and equipment for PVD epitaxial GaN, and is currently undergoing equipment process verification.

2015 XXX Institute of Metals XX National (Joint) Laboratory Cooperation for Materials Science

Diamond epitaxy equipment was fabricated, and diamond electrodes, microcrystalline and nanocrystalline diamond films, and conductive diamond films were prepared.

2007Cooperated with XX University School of Physics

Design and manufacture of optical grade diamond growth equipment (using thermal excitation technology and CVD technology).

2006 Cooperation with XX University of Science and Technology

Design Design UHT CVD and MBE.

For 4H crystal type SiC epitaxial growth.

2005 cooperated with the State Key Laboratory of Optical Instruments of XX University

Designed and manufactured the first molecular beam epitaxy equipment with completely independent intellectual property rights for epitaxy of optoelectronic semiconductor materials.

2001 Cooperated with XX University in 2001

A pilot-scale fully automated and monitored MOCVD is designed for epitaxial GaN and ZnO.